Thermal imager with Lock-In, Transient, and Pulse capability possess the ability to perform advanced inspections such as Non-Destructive Testing (NDT) or stress mapping that resolves temperature differences as low as 1 mK. NDT is a widely used method to evaluate the properties of a material, component or, system without causing damage. Thermal imaging cameras can detect internal defects through target excitation and the observation of thermal differences on a target's surface. It is a valuable tool for detecting defects and points of failure in composites, solar cells, bridges, and electronics. It is also a great tool for thermal mapping of stress when performing materials testing.

• Hyperspectral Imaging

  Hyperspectral imaging systems collect both spectral and spatial information in one instantaneous video frame. FLIR has teamed up with industry leaders to provide hyperspectral imaging solutions that help you learn more from your photons.

• Stress Analysis

  Stress and fatigue testing are common test methods in mechanical engineering and materials science, but provide limited information on complex structures.

• Composite Inspection

  Thermal non-destructive testing can detect internal defects through target excitation and the observation of thermal differences on a target surface.

• Solar Cell Inspection

  Solar cells may have electrical shunt defects. When the cell is energized, these shunts can be detected easily with Lock-In thermography.

• Crack Detection

  Lock-in thermographic inspection of critical parts for cracks is done by synchronizing the camera image capture with the frequency of energy going into a part.

• Bridge Inspection

  Bridge Deck Inspection is a Non destructive multi sensor technique that identifies areas of deterioration and calculates a quantitative index to determine the degree of deterioration for each span/lane of the bridge.

• Electronics Failure Analysis

  Failure Analysis (FA) testing on electronics is a common technique that utilizes a FLIR thermal camera to visualize and identify anomalies on small Integrated Circuits and PCB’s down to 3.5um spot sizes.